India Semiconductor
Intelligence

Silicon, silicon carbide, copper, aluminium, ceramic substrates and specialty minerals that feed into wafer fabrication and packaging.

Ultra-high purity gases, photoresists, etchants, solvents, fluorochemicals and cleaning chemicals used at every stage of fab and OSAT operations.

Ultra-pure water systems for fabs, OSAT, displays and precision electronics. Includes reverse osmosis, ion exchange, recycling and effluent treatment.

Contamination-controlled manufacturing environments with tightly regulated temperature, humidity, particle count, pressure and vibration.

RTL design, verification, SoC architecture, ASIC design, RF and analog design, embedded systems and IP licensing.

Precision components, motion stages, vacuum parts, dicing, grinding, slicing tools, automation and inspection sub-systems for fab and OSAT equipment.

Wafer manufacturing where transistors are patterned onto silicon or compound semiconductor wafers. Capital-intensive and yield-sensitive.

Outsourced semiconductor assembly and test: dicing, packaging, wire bonding, flip chip, advanced packaging and final test of finished chips.

Printed circuit boards and assembled boards that integrate chips, passives and connectors into functional electronic systems.

Electronics manufacturing services: PCB assembly, full product assembly, testing, packaging and lifecycle support for OEM customers.

Devices controlling high-voltage and high-current applications: EVs, renewables, industrial automation, railways, defence, data centers.

Final products that consume chips: smartphones, EVs, telecom equipment, industrial electronics, defence electronics, consumer appliances.

Specialized transport, storage and handling of high-purity chemicals, gases and sensitive semiconductor inputs and outputs.

Substations, EPC, industrial power infrastructure, gas and water systems for fabs, semiconductor parks and large electronics campuses.